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HDI PCB and high density interconnect PCB related technologies

Date:2021-10-20 Categories:Company news Hits:748 From:Shenzhen Safe De Technology Co.,Ltd


HDI PCBs require higher wiring density, finer traces and spacing, smaller vias and higher bond pad density than standard rigid PCBs. Blind hole and buried hole design is one of its remarkable features. HDI PCB is widely used in mobile phones, tablet computers, digital cameras, GPS, LCD modules and other fields. The advantages of HDI PCB include:
lower the cost
Better reliability
Increase wiring density
Improve design efficiency
Can improve thermal performance
In favor of advanced packaging technology
Better electrical performance and signal correctness
Can improve radio frequency interference, electromagnetic interference and electrostatic discharge
The advanced HDI technologies we currently use include: “copper fill” for special stacked microvias, and “laser direct imaging” (LDI) is designed for thin line technology to eliminate the size of artwork caused by environmental and material issues. Stability issue. “Direct Laser Drilling” (DLD) is a direct copper CO2 laser illuminating copper layer. Compared to additional conformal mask laser drilling, copper direct laser drilling provides higher accuracy and better accuracy for HDI projects. Hole quality and higher efficiency
 
HDI PCB General Specification
Number of floors: 4-20 layers
Stack type: 1 + N + 1, 2 + N + 2
Available materials: FR4, high Tg FR4, halogen-free FR4
Plate thickness: 0.4-3.2mm
Finished copper thickness: 1 / 3oz - 3oz
Minimum trace width / spacing: 3 / 3mil
Minimum through hole: 0.2mm
Minimum blind hole: 0.1mm
Surface treatment: immersion gold, ENIG + OSP
 
1. High Density Interconnect / HDI PCB
Number of layers: 6 (HDI)
Structure: 1 + 4 + 1
Material: FR4
Thickness: 0.8mm
Minimum trace width/pitch: 0.076 / 0.076mm (3 / 3mil)
Surface treatment
Blind holes L1-2 and L5-6: 0.1mm (4mil)
Buried by L2-5: 0.2 mm (8 mils)
Application: Telecommunications
 
 
HDI-pcb4electronic board
2. High Density Interconnect / HDI PCB
Number of layers: 8 (HDI)
Structure: 2 + 4 + 2, cross channel
Material: FR4 (halogen free)
Thickness: 1.0mm
Surface treatment
Blind holes L1-2 and L2-3 & L6-7 and L7-8: 0.1mm (4mil)
Buried by L3-6: 0.2 mm (8 mils)
Impedance control: differential 90 and 100 ohms
Application: Telecommunications
 
HDI-pcb5pcb - agreement
3. High Density Interconnect / HDI PCB
Number of layers: 8 (HDI)
Structure: 2 + 4 + 2, stacked through holes
Material: FR4 (Tg170)
Thickness: 1.0mm
Surface treatment; selective immersion gold + OSP
Blind holes L1-2 and L2-3 & L6-7 and L7-8: 0.1mm (4mil)
Buried by L3-6: 0.2 mm (8 mils)
Special process: filling copper on L2-3 and L6-7
Application: Telecommunications


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