HDI PCBs require higher wiring density, finer traces and spacing, smaller vias and higher bond pad density than standard rigid PCBs. Blind hole and buried hole design is one of its remarkable features. HDI PCB is widely used in mobile phones, tablet computers, digital cameras, GPS, LCD modules and other fields. The advantages of HDI PCB include:

lower the cost

Better reliability

Increase wiring density

Improve design efficiency

Can improve thermal performance

In favor of advanced packaging technology

Better electrical performance and signal correctness

Can improve radio frequency interference, electromagnetic interference and electrostatic discharge

The advanced HDI technologies we currently use include: “copper fill” for special stacked microvias, and “laser direct imaging” (LDI) is designed for thin line technology to eliminate the size of artwork caused by environmental and material issues. Stability issue. “Direct Laser Drilling” (DLD) is a direct copper CO2 laser illuminating copper layer. Compared to additional conformal mask laser drilling, copper direct laser drilling provides higher accuracy and better accuracy for HDI projects. Hole quality and higher efficiency

 

HDI PCB General Specification

Number of floors: 4-20 layers

Stack type: 1 + N + 1, 2 + N + 2

Available materials: FR4, high Tg FR4, halogen-free FR4

Plate thickness: 0.4-3.2mm

Finished copper thickness: 1 / 3oz - 3oz

Minimum trace width / spacing: 3 / 3mil

Minimum through hole: 0.2mm

Minimum blind hole: 0.1mm

Surface treatment: immersion gold, ENIG + OSP

 

1. High Density Interconnect / HDI PCB

Number of layers: 6 (HDI)

Structure: 1 + 4 + 1

Material: FR4

Thickness: 0.8mm

Minimum trace width/pitch: 0.076 / 0.076mm (3 / 3mil)

Surface treatment

Blind holes L1-2 and L5-6: 0.1mm (4mil)

Buried by L2-5: 0.2 mm (8 mils)

Application: Telecommunications

 

 

HDI-pcb4electronic board

2. High Density Interconnect / HDI PCB

Number of layers: 8 (HDI)

Structure: 2 + 4 + 2, cross channel

Material: FR4 (halogen free)

Thickness: 1.0mm

Surface treatment

Blind holes L1-2 and L2-3 & L6-7 and L7-8: 0.1mm (4mil)

Buried by L3-6: 0.2 mm (8 mils)

Impedance control: differential 90 and 100 ohms

Application: Telecommunications

 

HDI-pcb5pcb - agreement

3. High Density Interconnect / HDI PCB

Number of layers: 8 (HDI)

Structure: 2 + 4 + 2, stacked through holes

Material: FR4 (Tg170)

Thickness: 1.0mm

Surface treatment; selective immersion gold + OSP

Blind holes L1-2 and L2-3 & L6-7 and L7-8: 0.1mm (4mil)

Buried by L3-6: 0.2 mm (8 mils)

Special process: filling copper on L2-3 and L6-7

Application: Telecommunications